Light emitting device having multiple cavities and light unit having the same

ABSTRACT

A light emitting device and a light unit including the same are provided. The light emitting device includes a body, a first cavity disposed at a center of the body, the first cavity having an open upper side, a second cavity disposed around an upper portion of the body, the second cavity being spaced from the first cavity, first and second lead electrodes disposed within the first cavity, a light emitting chip disposed on at least one of the first and second lead electrodes, and a first molding member in the first cavity. The second cavity has an upper width greater than a lower width thereof and a side surface of the second cavity is formed of a vertical side surface with respect to a top surface of the body.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 U.S.C. §119(a) ofKorean Patent Application No. 10-2010-0028840 and 10-2010-0028841 filedon Mar. 30, 2010, which is hereby incorporated by reference in itsentirety.

BACKGROUND

Embodiments relate to a light emitting device and a light unit havingthe same.

In light emitting devices (LEDs), a P-N junction diode having theproperties of converting electrical energy into light energy may beformed by combining group III and V elements on the periodic table. LEDsmay implement various colors by controlling the composition ratio ofcompound semiconductors.

When a forward bias voltage is applied to the p-n junction diode, anelectron of an N-layer is recombined with a hole of a P-layer to emit anenergy corresponding to an energy gap between a conduction band and avalence band.

Since a nitride semiconductor that is a kind of materials forming theLEDs has high thermal stability and wide band gap energy, the nitridesemiconductor has been an object of high interest in the field ofdeveloping optical devices and high power electronic devices. Inparticular, blue LED, green LED, UV LED, etc. using a nitridesemiconductor have been commercialized and are being widely used.

SUMMARY

Embodiments provide a light emitting device having a new structure and alight unit using the same.

Embodiments provide a light emitting device having a second cavityperiphery a first cavity to receive a molding member overflowing fromthe first cavity.

Embodiments provide a light emitting device in which a contact areabetween a molding member and a light guide plate may be reduced.

Embodiments provide a light emitting device may improve reliability of alight emitting device and a light unit including the same.

In one embodiment, a light emitting device includes: a body including afirst cavity and a second cavity; first and second lead electrodesdisposed within the first cavity; and a light emitting chip disposedwithin the first cavity, wherein the first cavity and the second cavityhave an opening, and the second cavity is spaced apart from the firstcavity, and wherein the second cavity has an upper width greater than alower width thereof and a side surface of the second cavity is formed ina substantially vertical side surface with respect to a top surface ofthe body.

In another embodiment, a light emitting device includes: a body having afirst cavity; at least one lead electrode disposed within the firstcavity; a light emitting device disposed in the first cavity, the lightemitting device being electrically connected to the lead electrode; afirst molding member in the first cavity; and a second molding memberperiphery the first cavity of the body, wherein the second cavity has adepth less than about ⅕ of a depth of the first cavity from a topsurface of the body.

In further another embodiment, a light unit includes: a board; aplurality of light emitting devices disposed on the board; and a lightguide plate corresponding to the plurality of light emitting devices,wherein each of the light emitting devices includes: a body; a firstcavity disposed at a center of the body, the first cavity having anopened upper side; a second cavity disposed periphery an upper portionof the body, the second cavity being spaced from the first cavity; firstand second lead electrodes disposed within the first cavity; a lightemitting chip disposed on at least one of the first and second leadelectrodes; and a first molding member in the first cavity, wherein aninner side surface of the second cavity is disposed more close to thefirst cavity and is inclined in a direction of the first cavity withrespect to a bottom surface of the second cavity.

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below. Other features will be apparent fromthe description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a light emitting device according to anembodiment.

FIG. 2 is a side sectional view of the light emitting device of FIG. 1.

FIGS. 3 to 6 are views illustrating a process of manufacturing first andsecond molding members of a light emitting device according to anembodiment.

FIG. 7 is a side sectional view of a light emitting device according toa second embodiment.

FIG. 8 is a side sectional view of a light emitting device according toa third embodiment.

FIG. 9 is a top view of a light emitting device according to a fourthembodiment.

FIG. 10 is a side sectional view of a light emitting device according toa fifth embodiment.

FIG. 11 is a sectional view of a light emitting device according to asixth embodiment.

FIG. 12 is a sectional view of a light emitting device according to aseventh embodiment.

FIG. 13 is a sectional view of a light emitting device according to aneighth embodiment.

FIG. 14 is a sectional view of a light emitting device according to aninth embodiment.

FIG. 15 is a sectional view of a light emitting device according to atenth embodiment.

FIG. 16 is a plan view of a light emitting device according to aneleventh embodiment.

FIG. 17 is a plan view of a light emitting device according to a twelfthembodiment.

FIG. 18 is a plan view of a light emitting device according to athirteenth embodiment.

FIG. 19 is a plan view of a light emitting device according to afourteenth embodiment.

FIG. 20 is a plan view of a light emitting device according to afifteenth embodiment.

FIG. 21 is a sectional view of a light emitting device according to asixteenth embodiment.

FIG. 22 is s sectional view of a light unit according to a seventeenthembodiment.

FIG. 23 is a view illustrating a limitation due to contact of a moldingmember of a light emitting device with a light guide plate.

FIG. 24 is a view of the light emitting device and a light guide platein FIG. 22.

FIG. 25 is a view of a light unit according to an eighteenth embodiment.

FIG. 26 is a view of a display device including a light emitting deviceaccording to an embodiment.

FIG. 27 is a view illustrating another example of the display deviceincluding the light emitting device according to an embodiment.

FIG. 28 is a view of a lighting device including a light emitting deviceaccording to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the descriptions of embodiments, it will be understood that when alayer (or film), a region, a pattern, or a structure is referred to asbeing ‘on’ a substrate, a layer (or film), a region, a pad, or patterns,it can be directly on another layer or substrate, or intervening layersmay also be present. Further, it will be understood that when a layer isreferred to as being ‘under’ another layer, it can be directly underanother layer, and one or more intervening layers may also be present.Further, the reference about ‘on’ and ‘under’ each layer will be made onthe basis of drawings.

In the drawings, the thickness or size of each layer is exaggerated,omitted, or schematically illustrated for convenience in description andclarity. Also, the size of each element does not entirely reflect anactual size.

Hereinafter, a light emitting device according to embodiments will bedescribed with reference to the accompanying drawings.

FIG. 1 is a perspective view of a light emitting device 100 according toan embodiment, and FIG. 2 is a side sectional view of the light emittingdevice 100 of FIG. 1.

Referring to FIGS. 1 and 2, the light emitting device 100 according toan embodiment may have a body 10, a first cavity 15 defined in the body10, a second cavity 51 disposed in the body 10 and periphery the firstcavity 15, first and second lead electrodes 31 and 32 disposed withinthe body 10, a light emitting chip 20 disposed within the first cavity15 to electrically connect the first lead electrode 31 to the secondlead electrode 32, a first molding member 40 disposed in the firstcavity 15, and a second molding member 42 disposed in the second cavity51.

The second molding member 42 may have a top surface lower than that ofthe first molding member 40 with respect to a top surface of the body10. Thus, since a portion of the first molding member 40 defines thesecond molding member 42, the top surface of the second molding member42 may be further spaced from the top surface of the body 10 than thetop surface of the first molding member 40.

The body 10 may be formed of at least one of a resin material such aspolyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride(AlN), AlOx, photo sensitive glass (PSG), polyamide 9T (PA9T),syndiotactic polystyrene (SPS), a metal material, sappahire (Al₂O₃),beryllium oxide (BeO), and a printed circuit board (PCB). The body 10may be manufactured by an injection molding or etching process, but isnot limited thereto.

When the body 10 is formed of a material having thermal conductivity, aninsulation layer (not shown) may be disposed on a surface of the body 10to prevent the body 10 from being electrically shorted with the firstand second electrodes 31 and 32.

When the body 10 is formed of silicon (Si), a protection device such asa zener diode may be formed in an integrated circuit form through amethod in which a conductive dopant is injected into the body 10. Also,when the body 10 is formed of silicon, the body 10 may have an inclinedouter side surface.

The first and second cavities 15 and 51 may be defined in the body 10 toopen an upper side of the body 10.

For example, the first and second cavities 15 and 51 may be formed whilethe body 10 is injection-molded or may be separately formed by anetching process, but is not limited thereto.

The light emitting chip 20 may be disposed in the first cavity 15. Anupper region of the first cavity 15 serves as a light emission surfacethrough which light emitted from the light emitting chip 20 is emittedto the outside.

The first cavity 15 may have a cup shape or a concave container shape.The first cavity 15 may have a vertical or inclined inner side surfacewith respect to a bottom surface thereof. Also, the first cavity 15 mayhave a top surface having a circular shape, a square shape, a polygonalshape, or an oval shape when viewed from an upper side.

The second cavity 51 may be disposed around the first cavity 15 andspaced from the first cavity 15. The second cavity 51 may have a depthof less than about ⅕ of a depth of the first cavity 15 from a topsurface of the body 10. Alternatively, the second cavity 51 may have adepth of less than about ⅕ of a thickness of the body 10 from the topsurface of the body 10.

For example, as shown in FIG. 1, the second cavity 51 may have a closedcurve shape to surround a circumference of the first cavity 15, but isnot limited thereto.

The second molding member 42 overflowing when the first molding member40 is filled into the first cavity 15 may be filled into the secondcavity 51.

That is, since the light emitting device according to an embodiment hasthe second cavity 51, the first molding member 40 may have a top surfacewhich is substantially flush with the uppermost surface of the body 10.Also, defects occurring due to the overflowing of the molding member 40may be minimized to improve reliability. Specifically, the structureincluding the second cavity 51 may be very effective when the firstmolding member 40 is formed of a material having low viscosity.

The second cavity 51 may be defined so that an inner side surface 51 aadjacent to the first cavity 15 is inclined with respect to the bottomsurface thereof. The inner side surface may be inclined at an angle θ1of about 90° to about 170° with respect to the top surface of the body10. The inclined angle may be optimized according to the viscosity ofthe molding member 40. When the inner side surface 51 a is inclined, theoverflowing molding member may be easily introduced into the secondcavity 51. The inner side surface 51 a of the second cavity 51 isdisposed more close to the first cavity 15 to reduce an amount ofmolding member remaining in a region between the first cavity 15 and thesecond cavity 51. An other side surface of the second cavity 51 facingthe inner side surface may be substantially vertically disposed withrespect to the bottom surface of the first cavity 15 or has at an angleof about 90° to about 100° with respect to the bottom surface of thefirst cavity 15.

The top surface of the body 10 disposed between the first cavity 15 andthe second cavity 51 may be disposed flush with the top surface of thebody 10 disposed outside the second cavity 51.

The first and second lead electrodes 31 and 32 may be disposed on thebody 10 and electrically separated from each other. The first and secondlead electrodes 31 and 32 may be electrically connected to the lightemitting chip 20 to provide a power into the light emitting chip 20.

The first and second lead electrodes 31 and 32 may have one endsdisposed within the first cavity 15 of the body 10 and the other endsexposed to the outside or a lower surface of the body 10 along a surfaceof the body 10. Alternatively, the first and second lead electrodes 31and 32 may pass through the top and lower surfaces of the body 10 todefine a lower surface of the light emitting device 100. However, thepresent disclosure is not limited to the structure of the first andsecond lead electrodes 31 and 32.

The first and second lead electrodes 31 and 32 may be selectivelymanufactured using a plating process, a deposition process, or aphotolithography process, but is not limited thereto.

The first and second lead electrodes 31 and 32 may be formed of a metalmaterial having conductivity, e.g., at least one material or alloy ofTi, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Al, In, Pd, Co, Si, Ge, Hf, Ru,and Fe. Also, each of the first and second lead electrodes 31 and 32 mayhave a single- or multi-layer structure, but is not limited thereto.

The light emitting chip 20 may be disposed in the first cavity 15 of thebody 10. Specifically, the light emitting chip 20 may be disposed on abottom surface of the first cavity 15 or disposed on any one of thefirst and second lead electrodes 31 and 32.

For example, the light emitting chip 20 may be a light emitting diode(LED), but is not limited thereto.

When the light emitting chip 20 is the LED, the LED may be at least oneof a colored light emitting diode which emits light having a red, green,or blue color, a white light emitting diode which emits light having awhite color, and an ultraviolet (UV) light emitting diode, but it notlimited thereto.

The light emitting chip 20 may be formed of a group III-V compoundsemiconductor layer, e.g., GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN,AlGaAs, GaP, GaAs, GaAsP, or AlGaInP-based semiconductor material toemit light having proper colors of the semiconductor materials.

As shown in FIGS. 1 and 2, the light emitting chip 20 may beelectrically connected to the first and second lead electrodes 31 and 32through a wiring process. Alternatively, the light emitting chip 20 maybe electrically connected to the first and second lead electrodes 31 and32 through a chip bonding process or a flip-chip process, but is notlimited thereto.

The first molding member 40 may be disposed in the first cavity 15, andthe second molding member 42 may be disposed in the second cavity 51.

The first and second molding members 40 and 42 may be formed of the samematerial as each other. For example, each of the first and secondmolding members 40 and 42 may be formed of a light-transmitting siliconor resin material, but is not limited thereto.

The first molding member 40 may seal and protect the light emitting chip20. A top surface of the first molding member 40 serves as a lightemission surface through which light emitted from the light emittingchip 20 is emitted to the outside.

The first molding member 40 may have a flat top surface. Also, the firstmolding member 40 may have the top surface which is substantially flushwith the uppermost surface of the body 10.

The second molding member 42 may be disposed in the second cavity 51.Also, the second molding member may fill a portion of the second cavity51 or the entire second cavity 51.

FIGS. 3 to 6 are views illustrating a process of manufacturing the firstand second molding members 40 and 42 of the light emitting device 100according to an embodiment. Hereinafter, the process of manufacturingthe first and second molding members 40 and 42 will be described indetail with reference to FIGS. 3 to 6.

Referring to FIG. 3, the body 10 having the first and second cavities 15and 51 is prepared. The first and second cavities 15 and 51 may beformed in the body 10 through an injection molding or etching process,but is not limited thereto.

Referring to FIG. 4, a material 40 a forming the first and secondmolding members 40 and 42, e.g., a silicon or resin material may beintroduced into the first cavity 15 using a dispensing apparatus.

Referring to FIG. 5, when the material 40 a forming the first and secondmolding members 40 and 42 has low viscosity, a portion of the material40 a may flow outside the first cavity 15 and thus be introduced intothe second cavity 51. Specifically, since some silicon or resinmaterials have low viscosity at a temperature of about 30□ to about100□, the materials may not cohere in an upper region of the firstcavity 15, but overflow outside the first cavity 15.

Referring to FIG. 6, the material 40 a may flow outside the first cavity15 until the top surface of the first molding member 40 becomes flat sothat the top surface of the first molding member 40 is flush with theuppermost surface of the body 10. Then, when a curing process isperformed after the top surface of the first molding member 40 becomesflat, the light emitting device 100 according to an embodiment may beprovided.

A phosphor may be added to the first molding member 40. The lightemitted from the light emitting chip 20 may be changed in wavelength bythe phosphor.

For example, when the light emitting chip 20 is a blue light emittingdiode emitting blue light and the phosphor is a yellow phosphor emittingyellow excitation light, the light emitting device 100 may emit whitelight in which the blue light emitted from the light emitting chip 20and the yellow light emitted by exciting the yellow phosphor by the bluelight are mixed with each other.

FIG. 7 is a side sectional view of a light emitting device according toa second embodiment.

Referring to FIG. 7, a light emitting device 100 has a structure inwhich both inner side surfaces 52 a and 52 b of a second cavity 52 areinclined. Both inner side surfaces 52 a and 52 b of the second cavity 52may have a symmetrical structure. Alternatively, at least one sidesurface of the second cavity 52 may be substantially vertically disposedwith respect to the bottom surface of the first cavity 15 or inclinedwith respect to a vertical axis.

The second cavity 52 may have an upper width D1 greater than a lowerwidth D2.

FIG. 8 is a side sectional view of a light emitting device 100Baccording to a third embodiment.

Referring to FIG. 8, the light emitting device 100B is equal to thelight emitting device 100 of FIG. 1 except a depth of a second cavity53. Like the light emitting device 100 of FIG. 1, the second cavity 53may be shallow than a first cavity 15. Alternatively, like the lightemitting device 100B, the first and second cavities 15 and 53 may havethe same depth D3 as each other from the top surface of the body 10.That is, the depth of the second cavity 53 may be changed according tomaterials of first and second molding members 40 and 42 and a method ofmanufacturing the light emitting device.

FIG. 9 is a top view of a light emitting device 100C according to afourth embodiment.

Referring to FIG. 9, a second cavity 54 may be partially disposedperiphery a first cavity 15.

That is, the second cavity 54 may not be disposed along a closed curveas shown in the light emitting device 100 of FIG. 1, but be partiallydisposed as shown in the light emitting device 100C of FIG. 7. Thisstructure may be changed according to a design of the light emittingdevice. Each of the second cavities 54 is formed in a line shape or abar shape disposed outside the first cavity 15.

FIG. 10 is a side sectional view of a light emitting device 100Daccording to a fifth embodiment.

Referring to FIG. 10, a plurality of cavities 55 a, 55 b, and 55 c maybe defined outside a first cavity 15.

For example, as shown in FIG. 10, a second cavity 55 a, a third cavity55 b, and a fourth cavity 55 c may be sequentially defined outside thefirst cavity 15.

The second, third, and fourth cavities 55 a, 55 b, and 55 c may have thesame depth D4, D5, or D6 as each other or depths D4, D5, and D6different from each other. For example, the second, third, and fourthcavities 55 a, 55 b, and 55 c have the depths D4, D5, and D6 whichbecome gradually shallow. That is, the more the depths D4, D5, and D6 ofthe second, third, and fourth cavities 55 a, 55 b, and 55 c becomeshallow, the more the second, third, and fourth cavities 55 a, 55 b, and55 c are away from the first cavity 15. Also, second molding members 42a, 42 b, and 42 c may be fully or partially filled into the second,third, and fourth cavities 55 a, 55 b, and 55 c or may not be filledinto the second, third, and fourth cavities 55 a, 55 b, and 55 c, but isnot limited thereto.

The second cavity 55 a adjacent to the first cavity 15 among the second,third, and fourth cavities 55 a, 55 b, and 55 c has a depth deeper thanthat of the third cavity 55 c disposed in a sidewall of the body 10. Thethird cavity 55 c is disposed more close to a side surface of the body10 than the second cavity 55 a. Each of the inner side surfaces of thesecond, third, and fourth cavities 55 a, 55 b, and 55 c may be inclinedat an angle of about 90° to about 170° with respect to the top surfaceof the body 10. The inclined angle of the inner side surfaces of thesecond, third, and fourth cavities 55 a, 55 b, and 55 c may be differfrom each other.

FIG. 11 is a sectional view of a light emitting device according to asixth embodiment.

Referring to FIG. 11, a light emitting device 101 includes a body 110having a first cavity 115, a light emitting chip 130 within the firstcavity 115, a plurality of lead electrodes 111 and 113 within the firstcavity 115, a molding member 140 within the first cavity 115, and asecond cavity 120 around the first cavity 115 of the body 110.

For example, the body 110 may be formed of one of a resin material suchas PPA, a ceramic material, liquid crystal polymer (LCP), syndiotactic(SPS), poly(phenylene ether) (PPS), and a silicon material. However, thepresent disclosure is not limited to the material of the body 110. Thebody 110 may be integrally formed by injection molding or have astructure in which a plurality of layers are stacked. The body 110 maybe classified into a reflective part having the first cavity 115 on thelead electrodes 111 and 113 and a support part under the lead electrodes111 and 113, but is not limited thereto.

The body 110 has the first cavity 115 having an opened upper side at anupper portion thereof. The first cavity 115 may be formed by performinga patterning, punching, cutting, or etching process on the body 110.Alternatively, the first cavity 115 may be formed by a metal frameworkmolded in a shape equal to that of the first cavity 115 when the body110 is molded.

The first cavity 115 may have a cup shape or a container shape. Also, anouter shape of the first cavity 115 may have a circular shape, apolygonal shape, or a random shape, but is not limited thereto.

The first cavity 115 may have a vertical or inclined side surface 116with respect to a bottom surface of the first cavity 115 inconsideration of an illumination angle of the light emitting chip 130.Hereinafter, embodiments will describe the first cavity 115 having theinclined side surface 116 as an example.

A material having a high reflection effect, e.g., photo solder resist(PSR) ink having a white color, silver (Ag), or aluminum (Al) may becoated on the side surface 116 of the first cavity 115. Thus, lightemission efficiency of the light emitting chip 130 may be improved.

A depth A1 of the first cavity 115 represents a distance from topsurfaces of the lead electrodes 111 and 113 to a top surface of the body110. For example, the first cavity 115 may have a depth of about 150 μmto about 370 μm. The lead electrodes 111 and 113 may be realized by alead frame, but is not limited thereto.

The second cavity 120 is defined in an inner circumference of the body110. The second cavity 120 is defined inside the body 110 and around thefirst cavity 115. The second cavity 120 has a structure which is steppedfrom the first cavity 115 on the top surface of the body 110.

The plurality of lead electrodes 111 and 113 are disposed within thebody 110. The plurality of lead electrodes 111 and 113 may beelectrically separated from the bottom surface of the first cavity 115.Outer side parts of the plurality of lead electrodes 111 and 113 may beexposed to the outside of the body 110.

The plurality of lead electrodes 111 and 113 may have ends disposed on aside surface of the first cavity 115 or on a side opposite to that ofthe first cavity 115.

The plurality of lead electrodes 111 and 113 may be formed of a leadframe. The lead frame may be formed when the body 110 isinjection-molded.

The light emitting chip 130 may be attached to the first lead electrode111 of the plurality of lead electrodes 111 and 113. The light emittingchip 130 includes at least one LED chip. A colored LED chip or an UV LEDchip may be used as the LED chip.

The light emitting chip 130 may be electrically connected to theplurality of lead electrodes 111 and 113 using a plurality of wires 132.Alternatively, the light emitting chip 130 may be electrically connectedto the plurality of lead electrodes 111 and 113 by selectively using awire bonding, die bonding, or flip-chip bonding process, but is notlimited thereto.

A molding member 140 is disposed in the first cavity 115. The moldingmember 140 may be formed of a material such as silicon or epoxy or amaterial having a reflective index of less than about 2. At least onekind of phosphor or diffuser may be added to the molding member 140, butis not limited thereto.

The molding member 140 may be dispensed by a dispenser and molded intothe first cavity 115. Then, the molding member 140 may be thermallytreated at a predetermined temperature and cured. Here, due to a volumeof the first cavity 115 and errors due to the dispenser, the moldingmember 140 may have a thickness error of about ±30 μm. When an amount ofdispensed molding member 140 is large, the molding member 140 may have asurface having a concave lens shape. The surface having the concave lensshape may contact a light-incident part of a light guide plate. When thelight-incident part of the light guide plate contacts the surface of themolding member 140, optical losses (e.g., optical losses of a shortwavelength) may occur around the light-incident part of the light guideplate due to a thermal expansion coefficient difference between thelight guide plate and the molding member 140 on an interfacetherebetween.

The second cavity 120 is connected to the first cavity 115 of the body110. Also, the second cavity 120 provides a space in which the moldingmember 140 overflowing from the first cavity 115 is received. The secondcavity 120 may have a stepped structure enough to receive an amount ofmolding member 140 within an error range. The second cavity 120 may havea recessed structure, a groove structure, or a concave structure.

The second cavity 120 extends around an upper portion of the firstcavity 115. The second cavity 120 has a bottom surface parallel to thatof the first cavity 115 and a vertical sidewall till a top surfacethereof with respect to the bottom surface of the first cavity 115. Thebottom surface of the second cavity 120 may have a structure steppedfrom an upper end of the first cavity and a predetermined width C1. Thewidth C1 may be above about 0.05 mm. Also, the width C1 may be changedaccording to a size of a package.

A depth B1 of the second cavity 120 represents a distance between thetop surface and the lower surface of the body 110. The second cavity 120may have the depth B1 less than about ⅕ of a thickness (or height) ofthe body 110 or equal to about ⅕ of the depth A1 of the first cavity115.

The second cavity 120 may be defined in at least one region between theupper portion of the first cavity 115 and the body 110.

The top surface of the body 110 may have a width T1 equal to or lessthan that C1 of the second cavity 120, but is not limited thereto.

When a large amount of molding member 140 is supplied into the firstcavity 115, a portion of the molding member 140 may be disposed in thesecond cavity 120. That is, the molding member 140 is primarily filledinto the first cavity 115, and then, filled into the second cavity 120.

The second cavity 120 may buffer the excessively supplied molding member140. Thus, the molding member 140 may have a surface having a concavelens shape. The second cavity 120 may prevent a surface S1 of themolding member 140 from protruding in a convex lens shape with respectto an extending line S0 of the package.

FIG. 12 is a sectional view of a light emitting device according to aseventh embodiment. A portion of components to be described in theseventh embodiment will be described with reference to the sixthembodiment.

Referring to FIG. 12, a light emitting device 102 has a second cavity121 having a triangular shape. The second cavity 121 is connected to anupper end P1 of a side surface of a first cavity 115. The second cavity121 may have a depth greater than that of the upper end P1 of the sidesurface of the first cavity 115. A lower portion of the second cavity121 may have a predetermined depth B2 with respect to a top surface of abody 110. The depth B2 may be about ⅕ of a depth A1 of the first cavity115.

A portion of a molding member 141 may be disposed in the second cavity121. Thus, the molding member 141 of the first cavity 115 may be definedas a first molding member, and the molding member disposed in the secondcavity 121 may be defined as a second molding member.

Also, the upper end P1 of the first cavity 115 may be spaced apredetermined distance T2 from the top surface of the body 110. Aportion of the molding member 141 overflowing from the first cavity 115may be filled into the second cavity 121. The second cavity 121 may havea width C2 changed by the depth B2 and a side surface thereof, but isnot limited thereto.

A light emitting chip 130A may be mounted on a first lead electrode 111,and the light emitting chip 130A may be connected to a second leadelectrode 113 by a wire 132.

FIG. 13 is a sectional view of a light emitting device according to aneighth embodiment. A portion of components to be described in the eighthembodiment will be described with reference to the foregoingembodiments.

Referring to FIG. 13, a light emitting device 103 has a first cavity115. A molding member 142 is disposed in the first cavity 115. Themolding member 142 includes a first resin layer 142A at a lower portionthereof and a second resin layer 142B at an upper portion thereof. Thefirst resin layer 142A may be a transparent resin layer, and the secondresin layer 142B may be a transparent resin layer to which a phosphor isadded. In the current embodiment, the phosphor may be added to thesecond resin layer 142B to emit mixed light of light emitted from alight emitting chip 130A and light emitted from the phosphor.

The first resin layer 142A may have a top surface disposed at a positionlower than the highest point of the wire 132 connected to the lightemitting chip 130A. Since most of the wire 132 is fixed by the firstresin layer 142A, it may prevent the wire 132 from being moved andprevent a bonded portion of the wire 132 from being separated when thesecond resin layer 142B is formed.

FIG. 14 is a sectional view of a light emitting device according to aninth embodiment. A ninth embodiment will be described with reference tothe foregoing embodiments.

Referring to FIG. 14, a light emitting device 104 has a second cavity123 with a side surface 118 having a predetermined curvature. The secondcavity 123 may extend with a smoothly curved surface 118 from an upperend of a side surface of a first cavity 115 up to a top surface of abody 110. A molding member 144 is disposed in the first cavity 115 andsecond cavity 123.

FIG. 15 is a sectional view of a light emitting device according to atenth embodiment. A tenth embodiment will be described with reference tothe foregoing embodiments.

Referring to FIG. 15, a light emitting device 105 has a concave part121A in a lower portion of a side surface of a first cavity 115 and asecond cavity 124 around the first cavity 115.

The concave part 121A may increases a volume of a molding member 145filled into the first cavity 115. The second cavity 124 is definedphriphery an upper portion of the first cavity 115. The molding member145 molded in the first cavity 115 may be filled in the concave part121A, and a portion of the molding member 145 may be received into thesecond cavity 124 by overflowing over an upper end of the first cavity115.

Here, the second cavity 124 may have a height B2 and width C4 changedaccording to a size of the concave part 121A, but is not limitedthereto.

The body 110 may be embedded within a plurality of lead electrodes 111Aand 113A. The plurality of lead electrodes 111A and 113A may have bottomsurfaces disposed on the same line as that of the body 110. A lightemitting chip 130A may be mounted on a top surface of the first leadelectrode 111A. Also, the lower surface of the first lead electrode 111Amay become a lower surface of the light emitting device 105. Thus, heatgenerated from the light emitting chip 130A may be effectively emittedthrough the first lead electrode 111A and the second lead electrode113A.

FIG. 16 is a plan view of a light emitting device according to aneleventh embodiment. An eleventh embodiment will be described withreference to the foregoing embodiments.

Referring to FIG. 16, a light emitting device 106 has a first cavity 115disposed within a body 110 and a second cavity 125 disposed around thefirst cavity 115. The second cavity 125 extends from the first cavity115 toward the outside of the body 110. The second cavity 125 has a loopshape, a ring shape, or a band shape. The loop shape may include aclosed loop shape or an opened loop shape. A ring shape of the secondcavity 125 may include an oval shape or a polygonal shape. A moldingmember 146 is disposed in the first cavity 115 and the second cavity125.

FIG. 17 is a plan view of a light emitting device according to a twelfthembodiment. A twelfth embodiment will be described with reference to theforegoing embodiments.

Referring to FIG. 17, a light emitting device 107 has a first cavity hasa first cavity 115 disposed within a body 110 and a plurality of secondcavities 126 disposed around the first cavity 115. The plurality ofsecond cavities 126 may face both sides of the first cavity 115 andsurround both sides of the first cavity 115. The second cavity 126 mayhave a uniform width or an irregular width, but is not limited thereto.The second cavity 126 may change a critical angle of light in the lightemitting device 107. A molding member 146 is disposed in the firstcavity 115 and the second cavities 126.

FIG. 18 is a plan view of a light emitting device according to athirteenth embodiment. A thirteenth embodiment will be described withreference to the foregoing embodiments.

Referring to FIG. 18, a light emitting device 108 has a first cavity 115and second cavities disposed in both sides of the first cavity 115. Thesecond cavities 127 may be disposed in both sides of the first cavity115. Also, each of the second cavities 127 may have a length W3 greateror less than a width W1 of a bottom surface of the first cavity 115 or awidth W2 of an upper end of the first cavity 115. A molding member 146is disposed in the first cavity 115 and the second cavities 127.

FIG. 19 is a plan view of a light emitting device according to afourteenth embodiment. A fourteenth embodiment will be described withreference to the foregoing embodiments.

Referring to FIG. 19, a light emitting device 109 has a first cavity 115and second cavities 128 disposed in both sides of the first cavity 115.Each of the second cavities 128 is disposed along a length (L1)direction (a horizontal direction) of the first cavity 115. Also, eachof the second cavities 128 may have a semicircular shape or a half-ovalshape. Each of the second cavities 128 may have a maximum width C4changed according to the length L1 of the first cavity 115. A moldingmember 146 is disposed in the first cavity 115 and the second cavities148.

FIG. 20 is a plan view of a light emitting device according to afifteenth embodiment. A fifteenth embodiment will be described withreference to the foregoing embodiments.

Referring to FIG. 20, a light emitting device 109A has a first cavity115 and second cavities 129 disposed in both sides of the first cavity115. Each of the second cavities 129 is disposed along a width (L2)direction (a vertical direction) of the first cavity 115. Also, each ofthe second cavities 129 may have a semicircular shape or a half-ovalshape. A molding member 146 is disposed in the first cavity 115 and thesecond cavity 129.

FIG. 21 is a sectional view of a light emitting device according to asixteenth embodiment. A sixteenth embodiment will be described withreference to the foregoing embodiments.

Referring to FIG. 21, a light emitting device 101A has first cavities115A and 115B having a multi-layered structure. The first cavities 115Aand 115B having the multi-layered structure include a first lower cavity115A and a first upper cavity 115B. The first lower cavity 115A may berealized by a second lead electrode 113B disposed on a body 110. Thefirst upper cavity 115B is disposed on the first lower cavity 115A. Asecond cavity 120 may be disposed around the first upper cavity 115B. Amolding member 140A is disposed in the first cavity 115. A portion ofthe molding member 140A may be disposed in the second cavity 120.

A lower surface of the second lead electrode 113B may become a lowersurface of the light emitting device 101A. Thus, heat generated from alight emitting chip 130 may be effectively emitted to the outside.

FIG. 22 is a sectional view of a light unit according to a seventeenthembodiment. A seventeenth embodiment may selectively apply the lightemitting devices according to the foregoing embodiment(s). Indescription of this embodiment, the light emitting device will bedescribed with reference to the above-described package.

Referring to FIG. 22, a light unit 220 includes a board 215 on which aplurality of light emitting devices 101 are arrayed, a bottom cover 201,a reflective sheet 203, a light guide plate 205, an optical sheet 207,and a display panel 209.

Each of the light emitting devices 101 has a second cavity (seereference numeral 120 of FIG. 11) and faces a side of the light guideplate 205, e.g., a light-incident part 205A.

The plurality of light emitting devices 101 may be mounted on the board215. The board 215 may be coupled to the bottom cover 201 or a separateheatsink. The board 215 may include a flexible board, a resin PCB, ametal PCB, or a ceramic board, but is not limited thereto.

The bottom cover 201 may receive elements such as the reflective sheet203, the light guide plate 205, and the optical sheet 207. Also, thebottom cover 201 may have vertical or inclined circumference surface.The bottom cover 201 and the circumference surface may be formed of thesame material as each other or materials different from each other.

The reflective sheet 203 reflects light leaking through the light guideplate 205 or incident from the light emitting devices 101. The lightguide plate 205 diffuses the light incident from the light emittingdevices 101 to produce planar light. The reflective sheet 203 isdisposed under the light guide plate 205. The reflective sheet 203reflects the light leaking from the light guide plate 205. Thereflective sheet 203 may be not provided. In this case, a reflectivematerial may be coated on a bottom surface of the bottom cover 201.

The optical sheet 207 may selectively include a diffusion sheet, a prismsheet, and a brightness enhanced sheet, but is not limited thereto. Theoptical sheet 207 may be removed.

The display panel 209 displays information using light incident into aliquid crystal display (LCD).

FIG. 23 is a view illustrating an example of optical losses in a lightguide plate due to a configuration of a molding member of a lightemitting device.

Referring to FIG. 23, when a structure similar to that of the secondcavity (see reference numeral 120 of FIG. 11) is not provided in a lightemitting device 101B, a surface S2 of a molding member 140B may protrudein a convex lens shape. The surface S2 of the molding member 140B maycontact a light-incident part of a light guide plate 205. Heat generatedfrom a light emitting chip 130 is transmitted from the molding member140B to the light guide plate 205 by an operation of the light emittingdevice 101B. Here, optical losses due to a thermal expansion coefficientdifference between the light guide plate 205 and the molding member 140Bmay occur in a light-incident region Z1 of the light guide plate 205.That is, a loss of light (e.g., blue light) having a short wavelengthmay occur. Due to the optical losses, the blue light may be convertedinto bluish light to cause color defects overall.

FIG. 24 is a view of the light emitting device and the light guide platein FIG. 22.

Referring to FIG. 24, a distance G1 between the light emitting device101 and the light guide plate 205 may be about 0.01 mm to about 1 mm.Here, the molding member 140 may not protrude in a convex shape by thesecond cavity 120, but have a surface S2 having a concave lens shape.Thus, the predetermined gap G1 may be generated between the surface S1of the molding member 140 and the light guide plate 205. Here, the gapG1 may prevent the surface S1 of the molding member 140 and the lightguide plate 205 from contacting each other. Therefore, the distancebetween G1 between the light guide plate 205 and the light emittingdevice 101 may be further reduced to reduce the optical losses.

FIG. 25 is a view of a light unit according to an eighteenth embodiment.

Referring to FIG. 25, a light unit has a structure in which a portion ofa light emitting device 101 is inserted into a receiving groove 206defined in a light-incident part 205A of a light guide plate 205. Thatis, an upper portion of a body of the light emitting device 101 isreceived into the receiving groove 206 of the light guide plate 205. Adistance between a molding member 140 of the light emitting device 101and the light guide plate 205 may be about 0.01 mm to about 0.05 mm.

Thus, a surface S1 of the molding member 140, i.e., a central portion ofthe surface S1 may not contact a light-incident part of the light guideplate 205 by a second cavity 120. Therefore, a distance between thelight guide plate 205 and the light emitting device 101 may be reducedto reduce optical losses.

An optical sheet, a reflective plate, or a lens as well as the lightguide plate may be disposed at a light emission side of the lightemitting device according to an embodiment, but is not limited thereto.The light emitting device may be used for lighting devices such asstreet lamps and vehicle headlights, indicating devices, and signs, butis not limited thereto.

The light emitting device according to an embodiment may be applied to alight unit. The light unit has a structure in which a plurality of lightemitting devices are arrayed. The light unit may include the displaydevice shown in FIGS. 26 and 27 and the lighting device shown in FIG.28. Furthermore, the light unit may include illumination lamps, trafficlights, vehicle headlights, and signs.

FIG. 26 is an exploded perspective view of a display device according toan embodiment.

Referring to FIG. 26, a display device 1000 according to an embodimentmay include a light guide plate 1041, a light emitting module 1031providing light to the light guide plate 1041, a reflective member 1022disposed under the light guide plate 1041, an optical sheet 1051disposed above the light guide plate 1041, a display panel 1061 disposedabove the optical sheet 1051, and a bottom cover 1011 receiving thelight guide plate 1041, the light emitting module 1031, and thereflective member 1022, but is not limited thereto.

The bottom cover 1011, the reflective member 1022, the light guide plate1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 diffuses light to produce planar light. Thelight guide plate 1041 may be formed of a transparent material. Forexample, the light guide plate 1041 may be formed of one of an acrylicresin-based material such as polymethylmethacrylate (PMMA), apolyethylene terephthalate (PET) resin, a poly carbonate (PC) resin, acyclic olefin copolymer (COC) resin, and a polyethylene naphthalate(PEN) resin.

The light emitting module 1031 may provide light to at least one sidesurface of the light guide plate 1041. Thus, the light emitting module1031 may act as a light source of a display device.

At least one light emitting module 1031 may be disposed to directly orindirectly provide light to at least one side surface of the light guideplate 1041. The light emitting module 1031 may include a board 1033 andthe light emitting device 100 according to the above-describedembodiment. The light emitting device 100 may be arrayed on the board1033 by a predetermined distance.

The board 1033 may be a printed circuit board (PCB) including a circuitpattern (not shown). Also, the substrate 1033 may include a general PCB,a metal core PCB (MCPCB), and a flexible PCB (FPCB), but is not limitedthereto. When the light emitting device 100 are mounted on a sidesurface of the bottom cover 1011 or on a heatsink plate, the board 1033may be removed. Here, a portion of the heatsink plate may contact a topsurface of the bottom cover 1011.

The plurality of light emitting devices 100 may be mounted on the board1033 to allow a light emitting surface through which light is emittedfrom the board 1033 to be spaced a predetermined distance from the lightguide plate 1041, but is not limited thereto. The light emitting device100 may directly or indirectly provide light to a light incident surfacethat is a side surface of the light guide plate 1041, but is not limitedthereto.

The reflective member 1022 may be disposed under the light guide plate1041. Since the reflective member 1022 reflects light incident onto anunder surface of the light guide plate 1041 to supply the reflectedlight upward, brightness of the light unit 1050 may be improved. Forexample, the reflective member 1022 may be formed of one of PET, PC, andPVC, but is not limited thereto. The reflective member 1022 may be thetop surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the lightemitting module 1031, and the reflective member 1022. For this, thebottom cover 1011 may include a receiving part 1012 having a box shapewith an opened upper side, but is not limited thereto. The bottom cover1011 may be coupled to a top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resinmaterial. Also, the bottom cover 1011 may be manufactured using a pressmolding process or an extrusion molding process. The bottom cover 1011may be formed of a metal or non-metal material having superior heatconductivity, but is not limited thereto.

For example, the display panel 1061 may be a liquid crystal display(LCD) panel and include first and second boards formed of a transparentmaterial and facing each other and a liquid crystal layer between thefirst and second boards. A polarizing plate may be attached to at leastone surface of the display panel 1061. The present disclosure is notlimited to the attached structure of the polarizing plate. The displaypanel 1061 displays information using light transmitting the opticalsheet 1051. The display device 1000 may be applied to various portableterminals, monitors for notebook computers, monitors for laptopcomputers, televisions, etc.

The optical sheet 1051 is disposed between the display panel 1061 andthe light guide plate 1041 and includes at least one light-transmittingsheet. For example, the optical sheet 1051 may include at least one of adiffusion sheet, horizontal and vertical prism sheets, a brightnessenhanced sheet, etc. The diffusion sheet diffuses incident light, andthe horizontal or/and vertical prism sheet(s) collect(s) the incidentlight into a display region. In addition, the brightness enhanced sheetreuses lost light to improve the brightness. Also, a protection sheetmay be disposed on the display panel 1061, but is not limited thereto.

Here, optical members such as the light guide plate 1041 and the opticalsheet 1051 may be disposed on an optical path of the light emittingmodule 1031, but is not limited thereto.

FIG. 27 is a view of a display device according to an embodiment.

Referring to FIG. 27, a display device 1100 includes a bottom cover1152, a board 1120 on which the above-described light emitting devices100 are arrayed, an optical member 1154, and a display panel 1155.

The board 1120 and the light emitting devices 100 may be defined as alight emitting module 1060. The bottom cover 1152, the at least onelight emitting module 1060, and the optical member 1154 may be definedas a light unit.

The bottom cover 1152 may include a receiving part 1153, but is notlimited thereto.

Here, the optical member 1154 may include at least one of a lens, alight guide plate, a diffusion sheet, horizontal and vertical prismsheets, and a bright enhancement sheet. The light guide plate may beformed of a PC material or PMMA material. In this case, the light guideplate may be removed. The diffusion sheet diffuses incident light, andthe horizontal and vertical prism sheets collect the incident light intoa display region. The brightness enhanced sheet reuses lost light toimprove brightness.

The optical member 1154 is disposed on the light emitting module 1060 toproduce planar light using the light emitted from the light emittingmodule 1060 or diffuse and collect the light emitted from the lightemitting module 1060.

FIG. 28 is a view of a lighting device according to an embodiment.

Referring to FIG. 28, a lighting unit 1500 may include a case 1510, alight emitting module 1530 in the case 1510, and a connection terminal1520 disposed in the case 1510 to receive an electric power from anexternal power source.

The case 1510 may be preferably formed of a material having good heatdissipation characteristics, for example, a metal material or a resinmaterial.

The light emitting module 1530 may include a board 1532 and a lightemitting device 100 mounted on the board 1532. The light emitting device100 may be provided in plurality, and the plurality of light emittingdevices 100 may be arrayed in a matrix form or spaced a predetermineddistance from each other.

The board 1532 may be an insulator on which a circuit pattern isprinted. For example, the board may include a general printed circuitboard (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4, etc.

Also, the board 1532 may be formed of a material to efficiently reflectlight, and a surface thereof may be formed in a color capable ofefficiently reflecting light. For example, the board 1532 may be acoated layer having a white color or a silver color.

At least one light emitting device 100 may be mounted on the board 1532.Each of the light emitting devices 100 may include at least one lightemitting diode (LED) chip. The LED chip may include a color LED emittingred, green, blue or white light, and a UV LED emitting ultraviolet (UV)rays.

The light emitting module 1530 may have a combination of various lightemitting devices 100 to obtain desired color and luminance. For example,the light emitting module 1530 may have a combination of a white LED, ared LED, and a green LED to obtain a high color rendering index (CRI).

The connection terminal 1520 may be electrically connected to the lightemitting module 1530 to supply a power. The connection terminal 1520 maybe screw-coupled to an external power source in a socket type, but isnot limited thereto. For example, the connection terminal 1520 may bemade in a pin type and inserted into the external power source or may beconnected to the external power source through a wire.

The embodiments may prevent the resin material from overflowing in theLED. Also, the embodiments may prevent the resin material fromprotruding from the top surface of the LED. Also, the embodiments mayprovide a gap between the light emitting device and the light guideplate to prevent a color from being blurred in the light-incident partof the light guide plate.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device, comprising: a bodyincluding a first cavity and a second cavity; first and second leadelectrodes disposed within the first cavity; a light emitting chipdisposed within the first cavity; a first molding member in the firstcavity; and a concave portion concaved from a side surface of the firstcavity, wherein the first cavity and the second cavity have an opening,wherein the second cavity is spaced apart from the first cavity, whereinthe second cavity has an upper width greater than a lower width thereof,wherein a side surface of the second cavity is formed as a substantiallyvertical side surface with respect to a top surface of the body, whereinthe concave portion is spaced apart from a bottom surface of the firstcavity and the top surface of the body, and wherein the first moldingmember is disposed in the concave portion.
 2. The light emitting deviceaccording to claim 1, wherein the other side surface of the secondcavity is inclined with respect to the top surface of the body.
 3. Thelight emitting device according to claim 1, wherein the second cavity isdisposed in plurality in both sides of the body, and the plurality ofsecond cavities have depths different from each other in both sides ofthe first cavity and are disposed in parallel to each other.
 4. Thelight emitting device according to claim 1, wherein the top surface ofthe body disposed between the first cavity and the second cavity isflush with that of the body disposed outside the second cavity.
 5. Thelight emitting device according to claim 1, further comprising a secondmolding member in the second cavity.
 6. The light emitting deviceaccording to claim 5, wherein a top surface of the second molding memberis equal to or lower than that of the first molding member.
 7. The lightemitting device according to claim 1, wherein the second cavity has aring shape.
 8. The light emitting device according to claim 7, whereinthe second cavity includes an oval shape or a polygonal shape.
 9. Thelight emitting device according to claim 1, wherein the first and secondcavities have the same depth as each other.
 10. The light emittingdevice according to claim 5, wherein the first and second moldingmembers are formed of the same material as each other.
 11. The lightemitting device according to claim 3, wherein the plurality of secondcavities includes a third cavity and a fourth cavity, and wherein thethird cavity closer to the first cavity than the fourth cavity has adepth shallower than that of the fourth cavity closer to a sidewall ofthe body than the third cavity.
 12. The light emitting device accordingto claim 1, wherein the second cavity has a depth less than about ⅕ of adepth of the first cavity from the top surface of the body.
 13. Thelight emitting device according to claim 12, wherein the second cavityhas a depth less than about ⅕ of a thickness of the body from the topsurface of the body.
 14. The light emitting device according to claim12, wherein the first cavity and the second cavity are connected to eachother.
 15. A light unit, comprising: a board; a plurality of lightemitting devices disposed on the board; and a light guide platecorresponding to the plurality of light emitting devices, wherein eachof the plurality of light emitting devices comprises the light emittingdevice of claim
 1. 16. The light unit according to claim 15, wherein adistance between the light guide plate and each of the plurality oflight emitting devices is less than about 1 mm, and wherein a distancebetween the light guide plate and a surface of the second molding memberof each of the plurality of light emitting devices ranges from about0.01 mm to about 0.05 mm.
 17. The light emitting device according toclaim 1, wherein the second lead electrode includes a third cavitydisposed in the bottom surface of the first cavity, and wherein thelight emitting chip is disposed in the third cavity of the second leadelectrode.